MCCCD Official Course Competencies:

MIT111  19996-99999

Semiconductor Manufacturing Technology II

1.

Describe the principle of chemical vapor deposition. (I)

2.

List the materials deposited by CVD. (I)

3.

Describe the difference between various CVD systems. (I)

4.

Identify the components of a CVD reactor. (I)

5.

Describe the purpose and use of a thin-film fuse. (I, II)

6.

List the materials used in metalization of semiconductor devices. (II)

7.

Describe the operation of various metalization equipments. (II)

8.

List the methods and advantages of microscope and SEM inspection of wafer surfaces. (III)

9.

Explain the method used for pinhole counting. (III)

10.

List the four functions of a semiconductor package. (IV)

11.

List the common parts of a package. (IV)

12.

Describe the major packaging process flows. (IV)

13.

Explain the basic vacuum terminology and describe why vacuum is used in the manufacture of semiconductor devices. (V)

14.

Determine the fundamental information about gases that is necessary to understand vacuum device operation. (VI)

15.

Describe the various systems of units that are used to measure pressure and conversions between them. (VII)

16.

List the properties of the four states of matter and describe the transition between them. (VIII)

17.

Measure the vapor pressure for different substances at different pressures. (VIII)

MCCCD Official Course Competencies:

MIT111  19996-99999

Semiconductor Manufacturing Technology II

I.   Thin films-deposition

     A. Film parameters

     B. Chemical vapor deposition

     C. Atmospheric pressure systems

     D. Low-pressure chemical vapor deposition (LPCVD)

     E. Photochemical (ultraviolet) LPCVD

     F. Deposited films

II.  Thin films-metalization

     A. Metal film uses

     B.  Metal materials

     C. Deposition methods

     D. Vacuum pumps

III. Wafer test and evaluation

     A. Resistance and resistivity

     B. Layer thickness measurements

     C. Unction depth

     D. Contamination and defect detection

     E. Critical dimensions measurement

     F. Device electrical measurements

     I.   Pinhole counting

IV. Packaging

     A. Packaging operation

     B. Prepackaging wafer preparation

     C. Cleanliness and static control

     D. Package function and design

     E. Die separation, pick and plate, inspection and attach

     F. Bonding

     G. Sealing techniques

     H. Lead plating and trimming

V.  Vacuums

     A.  Definition of “vacuum”

     B.  Uses of vacuum in semiconductor manufacturing

          1.        Wafer handling

          2.        Cleaning

          3.        Wafer processing: removal of contaminants and chemical reactants to insure repeatable process pressures

VI. Gases

     A.  Composition of the atmosphere

     B.  Residual gas analyzer

     C.  Absolute temperature scale (Kelvin and Celsius)

     D.  Standard temperature and pressure

     E.  Brownian motion

          1.        Charles Law

          2.        Boyle Law

          3.        Dalton Law

     F.  Pressure

     G.  Mean free path

VII.     Measurement

     A.  Units of measure

          1.        Torr

          2.        Pascal

          3.        mbar

          4.        mm Hg

     B.  Conversions between pressure units

     C.  Pressure regimes (ranges)

          1.        Low vacuum

          2.        Medium vacuum

          3.        High vacuum

          4.        Ultra high vacuum

     D.  Pressure differential and net forces

VIII. States of matter

     A.  Solid state

     B.  Liquid state

     C.  Gas state

     D.  Ionic state

     E.  Sublimation, condensation and vaporization

     F.  Vapor pressure