1.
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Describe the history, development, and trends of the semiconductor
industry. (I)
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2.
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Explain the major product types and transistor building structures,
along with integration levels. (I)
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3.
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Explain the basics of chemistry as they apply to process chemicals.
(II)
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4.
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Explain the basics of atoms, electrical classifications of solids,
intrinsic and doped semiconductors. (II)
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5.
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Describe the techniques and structures required for formation of major
integrated circuits components in the wafer surface. (III)
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6.
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Explain the major integrated circuit types and their functions. (IV)
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7.
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Explain the basic planar operations performed on the wafer along with
the process sequences used to create the circuit components on the
chip surface. (V)
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8.
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Trace the circuit design from the functional diagram to the production
of a photomask. (V)
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9.
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Define both wafer and chip features and terminology. (V)
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10.
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Define and describe the crystalline material, i.e., ploycrystal,
single crystal, and amorphous. (VI)
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11.
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Identify the three major categories of crystal defects. (VI)
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12.
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Define major classes of contaminations and their effect on product
performance. (VII)
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13.
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Describe the clean-room area and the total clean-room concept. (VII)
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14.
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List the principal uses for thermal oxidation. (VIII)
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15.
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Describe the mechanism of thermal oxidation. (VIII)
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16.
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List the steps of the pre-oxidation process. (VIII)
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17.
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Relate the oxidation process in respect to time, temperature, and
crystal orientation. (VIII)
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18.
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Sketch and identify the basic sections of a tube furnace. (VIII)
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19.
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Explain the process of dry and wet oxidation as to the oxidation time,
thickness, and quality of each. (VIII)
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20.
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Describe chlorine and high pressure oxidation. (VIII)
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21.
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Compare all oxidation processes. (VIII)
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22.
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Explain the reaction of photoresist to light. (IX)
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23.
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List the steps to photomasking. (IX)
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24.
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Describe the need for, and the process used in, doublemasking,
multilayer resist processing, and planarization techniques. (IX)
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25.
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List and compare the optical and the nonoptical methods of alignment
and exposure. (IX)
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26.
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List the methods of developing. (X)
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27.
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Explain the purpose of soft and hard bake. (X)
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28.
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Explain the methods and relative merits of wet and dry etch. (X)
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29.
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Describe the use of resist strippers. (X)
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30.
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Explain the purpose and methods of final inspection. (X)
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31.
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Describe how resolution can be improved. (X)
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32.
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State the advantage of an image-reversal process. (X)
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33.
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Identify the parts and advantages of pellicle. (X)
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34.
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List and define the controlling and limiting factors of the diffusion
process. (XI)
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35.
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Define and describe the four steps of deposition. (XI)
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36.
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Define ion implant, listing advantages and disadvantages. (XI)
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37.
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Analyze an ion implanter. (XI)
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