| 1.
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Identify and describe various types of microelectronic packages. (I)
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| 2.
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Identify and describe types of materials commonly used in
microelectronic packaging, and explain the factors that must be
considered in selecting these materials. (II)
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| 3.
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Identify and describe types of interfaces used to connect the die to
the package. (III)
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| 4.
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Explain the processes used in microelectronic packaging. (I, III)
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| 5.
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Identify and explain the processes used in lead frame assembly and
design. (IV)
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| 6.
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Identify and explain the processes used in ball grid array assembly
and design. (V, VI)
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| 7.
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Use a high-end packaging design tool to design micro- electronic
packaging, demonstrating entry-level skill. (VII)
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