| 1.
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Describe the alignment and exposure process including development and
inspection. (I)
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| 2.
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Describe the differences between various crystal structures. (II)
|
| 3.
|
Describe the chemical vapor deposition process. (III)
|
| 4.
|
Contrast bipolar and MOS transistors, (IV)
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| 5.
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List the five steps of diffusion. (V)
|
| 6.
|
Describe the purposes of the epitaxial layers, the steps of its
growth, and characteristics used to evaluate it. (VI)
|
| 7.
|
Explain the purpose, process, and effect of ion implantation. (VII)
|
| 8.
|
Define regions and functions and their electrical functions. (VIII)
|
| 9.
|
Describe metalization, including its purpose, selection criteria, and
deposition methods. (IX)
|
| 10.
|
Describe the purpose and basic steps of photolithography. (X)
|
| 11.
|
List two types of photoresist and their performance factors. (XI)
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