Maricopa Community Colleges  GTC111   19952-20086 
Official Course Description: MCCCD Approval: 07/22/08
GTC111 19952-20086 LEC 3 Credit(s) 3 Period(s)
Semiconductor Processing Technology II
Semiconductor physics, doping, crystal growth, epitaxial growth, diffusion, oxidation, crystal defects, cleaning and etching, masking, photoresist, metalization, and vapor deposition. Emphasizes common processes, procedures, techniques, and problems.
Prerequisites: None.
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MCCCD Official Course Competencies:
 
GTC111   19952-20086 Semiconductor Processing Technology II
1. Explain how semiconductors work, and describe their major uses in the electronics industry. (I)
2. Describe the effects and problems associated with semiconductor doping. (II)
3. Describe the processes of crystal growth and wafer fabrication. (III, IV, V, VI)
4. Describe the procedures and problems involved in the epitaxial growth, diffusion, oxidation, metalization, and vapor deposition processes used in semiconductor manufacturing. (VII, XI, XII)
5. Describe the cleaning processes, mask making, and photoresist techniques used in wafer processing. (VIII, IX, X)
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MCCCD Official Course Outline:
 
GTC111   19952-20086 Semiconductor Processing Technology II
    I. Fundamentals of Semiconductor Processing
        A. Conductors
        B. Insulators
        C. Semiconductors
        D. Resistance
        E. Resistivity
        F. Conductivity
        G. Uses of semiconductors
      II. Semiconductor Doping
          A. Effects of dopants
          B. Problems
        III. Crystal Growth
            A. Techniques
            B. Problems
            C. Crystallography
          IV. Epitaxial Growth
              A. Techniques
              B. Problems
              C. Growth
            V. Diffusion
                A. Techniques
                B. Problems
                C. Time dependence
              VI. Oxidation
                  A. Theory
                  B. Techniques
                VII. Crystal Defects
                    A. Surface damage
                    B. Carbide, nitride, and melting
                  VIII. Cleaning Techniques
                      A. Etching silicon
                      B. Si02
                    IX. Masking
                        A. Procedures
                        B. Problems
                      X. Photoresist Processing
                          A. Procedures
                          B. Problems
                        XI. Metalization
                            A. Techniques
                            B. Problems
                          XII. Vapor Deposition
                              A. Techniques
                              B. Problems
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