MCCCD Official Course Competencies:

ELE173  1992 Fall – 2012 Summer II

Fabrication Techniques

1.

Identify electronics components and fundamental subsystems, symbols, schematics, and physical descriptions. (I)

2.

Draw, as per industry standards, electronics symbols, schematics, and electromechanical layouts. (II)

3.

Apply electronics fabrication techniques including soldering, desoldering, wire wrapping, printed circuit board etching, and various assembly techniques. (III)

4.

Trace schematics accurately as to circuit flow, interpret purpose, apply troubleshooting and diagnostic techniques. (IV)

MCCCD Official Course Outline:

ELE173  1992 Fall – 2012 Summer II

Fabrication Techniques

I. Identification and Recognition of Electronics Components and Circuits

A. Schematic symbols

B. Manufacturer's ratings and specifications

C. Physical aspects of devices in electronics

D. Physical aspects and specifications of common subsystems such as power supplies

E. Connectors, wire sizes and types, cable types and harnessing

F. Coding techniques used to label components/subsystems

II. Documentation of Electronic Circuits, Subsystems, and Systems

A. Techniques of electronic drafting

B. Techniques of electromechanical drawing

C. Techniques of taping, layout, and reduction for PC boards

D. Techniques used in CAD/CAM systems

III. Techniques of Electronic Fabrication

A. Soldering techniques

B. Desoldering techniques

C. Wire wrapping techniques

D. Printed circuit board etching technique skills

E. Electromechanical assembly and construction techniques

F. Chassis and motherboard assembly techniques

IV. Schematic Interpretation, Troubleshooting, and Diagnostics

A. Interpreting the schematic to construct the physical equipment

B. Techniques of schematic tracing and wire busses

C. Fundamentals of troubleshooting and diagnostics