Maricopa Community Colleges  CAD246   19966-99999 

Official Course Description: MCCCD Approval: 04/23/96

CAD246  1996 Fall – 2012 Fall

L+L

1 Credit(s)

2 Period(s)

Discrete Component Single-Sided Printed Circuit Board Design

Generation of appropriate design documentation for the building of a single-sided printed wiring board (PWB) and the production of the electronic component assembly (ECA).

Prerequisites: CAD240 or permission of Instructor.

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MCCCD Official Course Competencies:

 

CAD246  1996 Fall – 2012 Fall

Discrete Component Single-Sided Printed Circuit Board Design

 

1.

Generate a design layout from a schematic diagram. (I)

2.

List the steps in manufacturing a PWB. (I-IV)

3.

Identify the basic function of an ECA. (I-V)

4.

Generate a PWB artwork from a design layout. (II)

5.

Generate a drill plan as part of a PWB package. (III)

6.

Generate a silkscreen mask for a PWB, using a given design layout. (IV)

7.

Produce a circuit component assembly drawing from a design layout. (V)

8.

Generate, as a member of a team, an ECA/PWB drawing package for a discrete component, single-sided printed circuit board. (I-V)

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MCCCD Official Course Outline:

 

CAD246  1996 Fall – 2012 Fall

Discrete Component Single-Sided Printed Circuit Board Design

 

I. Design layout

A. The printed wiring board (PWB)

1. PWB types

a. Single sided

b. Double sided

c. Multilayered

2. Board materials

3. The photo resist method

B. Hardware parameters

1. Design grids

2. Axial and radial lead components

3. Hole spacing

4. Hole sizes

5. Connectors

C. Schematic to design layout

D. Component arrangement

1. Axial lead

2. Radial lead

E. Component density

F. Scale

II. Artwork

A. Mechanical method

1. Taping technique

2. Pad rub-offs

3. Targets

B. CAD methods

1. Pline vs. wide rapidograph

2. Pad libraries

3. Grid spacing

4. Targets

5. PWB identification

6. CCA identification

III. Drill plan

A. Calculating hole sizes

B. Hole schedules

C. Fabrication notes

IV. Silkscreen

A. Silkscreen mask

B. Registration to targets

C. Component outline and reference designators

V. Circuit card assembly (CCA)

A. Relating the components to the board

B. Operation sheets

 

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